Processing technique of pottery and porcelain

1. Machining machining is the traditional processing technique of material of pottery and porcelain, also be the treatment method with applied the widest range. Machining basically is to show to pottery and porcelain material undertakes turning, cut, grinding, bore wait. Its craft is simple, treatment efficiency is tall, but as a result of material of pottery and porcelain tall hard, tall fragile, because this machining processes form hard precision of complex, dimension surface roughness of tall, surface is low, tall the component of project pottery and porcelain of dependability. Next graphs are cut, grinding, auger cut treatment sketch map. The grinding of B of treatment of cut of A of machining sketch map of pottery and porcelain machines C getting to cut treatment (1) the treatment of cutting treatment cutting of material of pottery and porcelain is to use diamond, cubic nitrogen to change boracic, hard alloy to wait exceed strong cutting tool to have planar treatment to material of pottery and porcelain, use normally wet cutting, provide eject cutting juice to the knife ceaselessly namely. The main purpose of use cutting fluid is to take away cutting the drossy, attrition that reduces cutting tool and material, drop cutting tool and the temperature that process data, prolong cutting tool service life, reduce material surface injury to wait. Because treatment process is medium, material surface gets mechanical stress action, mouth of indentation, collapse, surface and micro-crack of table lower level arise easily in material surface. The choice of fluid of cutting tool, cutting, of the craft parameter such as speed of feed of cutting tool cutting, feed optimize, it is the research heat problem that cutting of material of pottery and porcelain machines. (2) appearance of substance of agglomeration of pottery and porcelain of treatment of the grinding of material of pottery and porcelain, polish, because be in,shape, the fetching and many dent, micro-crack blemish in agglomeration and treatment process, use in the project before reaching mechanical function to check, need to pass normally grinding, abrade handle with polishing. Their treatment mechanism is to pass abrasive and workpiece of pottery and porcelain to be below constant pressure action, as the mutual motion of abrasive and material surface, concave and convex peak of abrasive grain and workpiece surface chafes each other in order to realize the level off sex of material surface. The choice of fluid of abrasive, grinding, the control of action pressure and mutual slippage speed is this key that machines a method. (3) the part of pottery and porcelain that the engineering field such as machinery of aviation of the engine of bore treatment pottery and porcelain of material of pottery and porcelain, spaceflight, chemical industry uses, need those who have hole to get normally cut treatment. The hole treatment that contains whorl especially is the technology operation with the extremely high demand in craft of treatment of material of pottery and porcelain. At present power drill cuts a method to be able to machine the hole of pottery and porcelain of several millimeter only. The treatment of small hole needs supersonic, laser, discharge to machine, and the compound treatment of the processing technique such as machining. 2. Discharge is machined 1947 B.

R.

The Lazarenko new thinking that put forward discharge to process horniness metal data. 80 time end, discharge processing technique is introduced material of pottery and porcelain machines a domain. Consider to make clear: When single-phase or pottery and porcelain / pottery and porcelain, pottery and porcelain / the resistor of metallic composite material is less than 100 Ω .

When M, material of pottery and porcelain can undertake discharging machining, machine a principle slightly. According to the fundamental that discharge machines, the machinability of material basically can depend on function of electricity, hot physics, be like: Electrical conductivity, melting point, specific heat, coefficient of thermal conductivity. Discharge treatment is surface roughness of precision of preparation expensive measure, low surface, complex form the processing technique that component of high-powered pottery and porcelain has applied perspective very much, study discharge machines craft to control measure deep, the material of answer photograph pottery and porcelain of design and function of preparation electric conduction and beautiful of mechanical function all is the key that this method future develops. 3. Treatment of ultrasonic treatment ultrasonic is to use the tool that produces supersonic vibration (mould) , drive the fluid of abrasive in suspension between tool and component of pottery and porcelain, pound and cast grind workpiece to undertake machining. The feed that goes up in three-dimensional direction as the tool, the tool carries the appearance of the ministry to be duplicated to be on workpiece of pottery and porcelain stage by stage. Commonly used abrasive is carbonization boron, carborundum and alumina. The working fluid that chooses commonly is water, to improve the treatment quality of material surface, usable also kerosene or engine oil make liquid medium. Consider to make clear: When making material of pottery and porcelain of ultrasonic vibration grinding with diamond emery wheel, the purify rate of material increases along with what machine intensity and heighten, achieve some only when critical intensity of pressure, abrasive just has grinding effect to material of pottery and porcelain. The principle that ultrasonic machines slightly. The craft parameter that ultrasonic of material of partial pottery and porcelain machines expresses place to show as follows. Material of partial pottery and porcelain uses the parameter that ultrasonic machines to express Normal Align=center> makes the name of an article weigh Normal MARGIN of Center" Align=center> abrasive: 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center> machines speed (Mm/min)normal MARGIN of Center" Align=center> abrasive: 0cm 0cm 0pt; TEXT-ALIGN: Eye of Center" Align=center> abrasive counts Normal Align=center> quartz Normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>SiCnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>320normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>5.

5normal MARGIN of Center" Align=center> single crystal: 0cm 0cm 0pt; TEXT-ALIGN: Normal Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>SiCnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>320normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>3.

5normal MARGIN of Center" Align=center> ruby: 0cm 0cm 0pt; TEXT-ALIGN: Normal Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>SiCnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>280normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>0.

8normal Align=center>normal Align=center>Al2O3normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>SiCnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>280normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>3.

6normal Align=center>Si3N4normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>Bvalue="4" UnitName="C">4Cnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>280normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>3.

0normal Align=center>SiCnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>Bvalue="4" UnitName="C">4Cnormal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>280normal MARGIN of Center" Align=center> 　 : 0cm 0cm 0pt; TEXT-ALIGN: Center" Align=center>3.

04. Laser beam machining adopts laser bore and cut on material of pottery and porcelain, general place needs laser power to be 150W ～ 15kW. But like be being machined with discharge, because thermal conductance of material of pottery and porcelain is low, high-energy bundle thermal stress may arise to center in material surface, form micro-crack, big drossy, even material ruptures. Laser beam machining agrees with to wait for mineral material in organic matter and pottery and porcelain aspirant travel small bore, small cut, make small structure. Already can machine a diameter to be 4 ～ at present the small hole that 5 μ M, ratio of pit-depth to pit-diameter amounts to 10 above. Normally place is CO2 and Nd with laser source: YAG laser. 5. What compound treatment is aimed at material of different pottery and porcelain and material of pottery and porcelain is different thermodynamic, content turns performance, traditional machining technology is ceaseless and perfect, at the same time new-style processing technique emerges in endlessly. Efficiency of traditional processing technique precision of tall, dimension low, surface is bright and clean spend difference, the processing technique such as all sorts of new-style report, hot, chemical, laser suits to machine precision to ask tall, form is complex have specific property at the same time (conductivity, chemical character) material of pottery and porcelain, but have treatment efficiency at the same time size of shape of treatment of low, requirement is small etc. In recent years, all sorts of compound processing technique get take seriously extensively and applied in lab and engineering field. All sorts of compound processing technique include: Chemical machining, electroanalysis grinding, supersonic mechanical grinding, electric spark grinding, supersonic electric spark is compound treatment, electroanalysis electric spark is compound treatment, electroanalysis grinding of electric spark machinery is compound treatment. Project practice makes clear: The treatment efficiency that compound processing technique can improve data and the exterior quality of the material after improvement is machined, it is one of tendencies that processing technique of material of pottery and porcelain develops. Below with the chemical and mechanical effect in chemical machining (the advantage that Chemmechanical) will come to show compound treatment. In process of the grinding of material of pottery and porcelain, cutting, fluid of the grinding of eject, cutting passes as mutual as what add workpiece face chemical bond, bright and clean to the purify rate of material and surface degree have distinct effect. Because machine the mechanical energy that attrition produces, cause a lot of mixed chemical reaction. This kind so called " chemical and mechanical effect " the purify rate of the surface roughness of surface of the wear rate of the coefficient of friction in affecting machine treatment process directly, cutting tool or emery wheel, material and mechanical function, material. Because this analysis is mixed,the natural science that studies fluid of grinding, cutting changes function to machine the influence of function to material of pottery and porcelain, fluid of the cutting with proper choice, grinding is very important also. Liang H. Etc studied cutting fluid, grinding fluid and sapphirine, alumina is much brilliant material, monocrystalline silicon, nitrogen changes glass of carborundum and silicon, silicon to wait for the chemical machinery in treatment action. Consider to make clear: Boric acid and siliceous aqueous solution regard the cutting of material of different pottery and porcelain as fluid respectively, its bore efficiency raises 50 ％ left and right sides with cutting fluid than water and business. Jahanmir S.

Wait for discovery, when processing data of alumina much brilliant, boric acid replaces water to make cutting juice, bore rate rises, and boric acid is mixed to sapphirine material of silicon radical pottery and porcelain criterion the effect with end same discovery. Estimating a likelihood is boric acid and alumina the amorphous crystal boundary of much brilliant material is contrary should, make happen between grain rupture, raised material to machine the purify rate in the process. Another kind of compound is siliceous not with alumina interaction, can raise monocrystalline silicon, nitrogen to turn the treatment performance of material of silicon, carborundum however, the mechanism of this chemical and mechanical action is not at present clear still. CNC Milling